Features:
1. Motherboard PCB fixture, CPU NAND PCIE glue remove, fingerprint repair fxture Multi-Function in one 2. Uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell phone motherboard, apply heat conduction sticker on the back of the IC on motherboard to prevent metal directly touching IC and cause IC damage, pure copper heat conduction block does not directly contact the main board 3. PCB repair platform added CPU positioning structure. No manual positioning needed, improve the success rate. 4. PCB repair platform designed with integrated layer tin planting function. The precision stencils are produced by world's leading laser technology. 5. PCB repair platform added motherboard layer separation and positioning installation structure. 6. Designed with precision positioning column, it will makes efficient repairs for separating, soldering and installation. 7. Pure copper heat conduction material are dealt with special process so that surface color will keep new. 8. Precise snap design, do not hurt the motherboard
Package：
1 x MECHANIC Fixture
Logistics information
Our products are located in Hong Kong, China, and the logistics speed depends on your specific location. According to our experience, it usually takes about 15-20 days of transportation time
CONTACT US
RETURNS POLICY
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SHIPPING
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How to choose the correct size:
Step 1 Please measure your foot length carefully.
Step 2 Please choose the correct size according to your foot length and chinese size.
For example, If your foot length is 255 mm , you should choose the size 8.
